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Cushion pad - List of Manufacturers, Suppliers, Companies and Products

Cushion pad Product List

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Laminated wear-resistant material with aluminum foil laminated cushion pad

Laminated wear-resistant material with aluminum foil laminated cushion pad

Ideal for high-pressure pressing processes in soft-type FPC board manufacturing!

The aluminum foil laminated cushion pad is specially designed for the first layer of the soft type FPC substrate manufacturing lamination process (high-temperature pressing). The pad, composed of aluminum foil and silicone rubber, excels in shock absorption and high-pressure characteristics, making it ideal for filling the gap between patterns in the FPC lamination process. Its smooth silicone surface offers excellent friction durability and chemical resistance. For more details, please contact us or refer to the catalog.

  • Composite Materials

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Layered, abrasion-resistant material layered cushion pad

Layered, abrasion-resistant material layered cushion pad

Available for use in the lamination process of printed circuit boards and FPC boards (high-temperature pressing)!

The laminated cushion pad is specially designed as an alternative to traditional craft paper for the lamination process (high-temperature pressing) of printed circuit boards and FPC boards. The product is composed of laminated silicone glass fiber reinforcement, demonstrating excellent shock absorption capability and high-pressure durability during the manufacturing process. The thick, rigid surface excels in abrasion resistance and chemical reaction resistance. Products are available in various dimensions and thicknesses in two standard colors. For more details, please contact us or refer to the catalog.

  • Composite Materials

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Layered wear-resistant material with iron foil laminated cushion pad

Layered wear-resistant material with iron foil laminated cushion pad

Ideal for high-pressure pressing processes in soft-type FPC board manufacturing!

The iron foil laminated cushion pad is specially designed for the bottom layer of the soft type FPC substrate manufacturing lamination process (high-temperature pressing). The pad, composed of iron foil and silicone rubber, excels in shock absorption and high-pressure characteristics, maintaining horizontal alignment during the pressing process. Its smooth and hard silicone surface offers excellent friction durability and chemical resistance. For more details, please contact us or refer to the catalog.

  • Composite Materials

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Layered hot press cushion pad "King Board"

Layered hot press cushion pad "King Board"

No surface foreign matter, excellent release properties maximize yield.

"King Board" is a cushion pad used in the lamination process when press forming multilayer PCBs and ceramic laminates. It utilizes special rubber components to provide thickness stability, dimensional stability, and uniform heat distribution during hot press operations, while also ensuring no surface contaminants and excellent release properties, maximizing yield. 【Features】 ■ Excellent heat resistance, chemical resistance, elasticity, and thermal conductivity ■ Uniform temperature distribution and pressure ■ Washable after use ■ Cost reduction ■ Improved yield ■ Assurance of high quality (no surface contaminants) *For more details, please refer to the PDF document or feel free to contact us.

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